Description

This Terragriff mounting accessory enables equipotential bonding between the module frame and the 40×40 / 80×40 profile (also for black anodized profiles, module clamps and on the module frame). Variants for 60 mm wide profiles also available.

Easy to attach to the profile. When placed around the center clamp, equipotential bonding takes place for both connected modules. The TerraGrif is inserted under the module clamp and thus increases the connection to the module for potential equalization. It does not matter whether the module is mounted horizontally or vertically.

For equipotential bonding with trapezoidal rails, please use the short earthing terminal for the M8 channel on top.

Material: Stainless steel 301 TA. PU 500 pieces each.